Chipmos Technologies Ltd. (IMOS) Lowered to “Hold” at ValuEngine
Chipmos Technologies Ltd. (NASDAQ:IMOS) was downgraded by equities researchers at ValuEngine from a “buy” rating to a “hold” rating in a report released on Tuesday.
Separately, Zacks Investment Research raised shares of Chipmos Technologies from a “strong sell” rating to a “hold” rating in a research report on Wednesday, October 11th.
Chipmos Technologies (NASDAQ:IMOS) opened at $17.70 on Tuesday. The stock has a market cap of $795.93, a PE ratio of 14.75, a PEG ratio of 1.84 and a beta of 0.22. The company has a current ratio of 2.38, a quick ratio of 2.08 and a debt-to-equity ratio of 0.47. Chipmos Technologies has a 1 year low of $13.94 and a 1 year high of $21.99.
Hedge funds and other institutional investors have recently made changes to their positions in the stock. Morgan Stanley lifted its position in Chipmos Technologies by 944.4% in the 1st quarter. Morgan Stanley now owns 149,303 shares of the semiconductor company’s stock valued at $2,651,000 after acquiring an additional 135,007 shares in the last quarter. Dimensional Fund Advisors LP bought a new position in Chipmos Technologies in the 1st quarter valued at about $1,571,000. Renaissance Group LLC lifted its position in Chipmos Technologies by 11.9% in the 2nd quarter. Renaissance Group LLC now owns 19,643 shares of the semiconductor company’s stock valued at $388,000 after acquiring an additional 2,085 shares in the last quarter. HighTower Advisors LLC bought a new position in Chipmos Technologies in the 2nd quarter valued at about $974,000. Finally, Airain ltd bought a new position in Chipmos Technologies in the 2nd quarter valued at about $242,000. 19.19% of the stock is currently owned by institutional investors and hedge funds.
About Chipmos Technologies
ChipMOS TECHNOLOGIES INC is a Taiwan-based company principally engaged in the integrated circuits packaging and testing business. The Company mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services, among others.
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