BlackRock Inc. Acquires New Position in ASE Technology Holding Co Ltd (ASX)
BlackRock Inc. acquired a new stake in ASE Technology Holding Co Ltd (NYSE:ASX) in the 2nd quarter, according to the company in its most recent disclosure with the Securities & Exchange Commission. The institutional investor acquired 300,386 shares of the semiconductor company’s stock, valued at approximately $1,382,000.
Several other institutional investors have also recently added to or reduced their stakes in ASX. US Bancorp DE acquired a new stake in ASE Technology during the 2nd quarter valued at approximately $107,000. Bessemer Group Inc. acquired a new stake in ASE Technology during the 2nd quarter valued at approximately $143,000. Canada Pension Plan Investment Board acquired a new stake in ASE Technology during the 2nd quarter valued at approximately $220,000. Greenleaf Trust increased its position in ASE Technology by 24.0% during the 2nd quarter. Greenleaf Trust now owns 54,816 shares of the semiconductor company’s stock valued at $252,000 after purchasing an additional 10,615 shares during the period. Finally, Segall Bryant & Hamill LLC acquired a new stake in ASE Technology during the 2nd quarter valued at approximately $322,000. 5.42% of the stock is owned by institutional investors.
A number of analysts have weighed in on the stock. CLSA downgraded shares of ASE Technology from an “outperform” rating to an “underperform” rating in a research report on Monday, October 8th. ValuEngine downgraded shares of ASE Technology from a “hold” rating to a “sell” rating in a research report on Saturday, October 6th. Finally, JPMorgan Chase & Co. downgraded shares of ASE Technology from an “overweight” rating to a “neutral” rating in a research report on Wednesday, October 10th. Two research analysts have rated the stock with a sell rating and two have assigned a hold rating to the stock. The company presently has a consensus rating of “Hold” and a consensus target price of $8.25.
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ASE Technology Company Profile
ASE Technology Holding Co, Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services (EMS) in the United States, Taiwan, Asia, Europe, and internationally. The company offers packaging services, including flip-chip ball grid array (BGA), flip-chip chip scale package (fcCSP), advanced chip scale packages (aCSP), quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, high-band package on package, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions, as well as module-based solutions.
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