Firan Technology Group Co. (TSE:FTG) Director Amy Rice Buys 4,000 Shares

Posted by Jessica Moore on Apr 22nd, 2024

Firan Technology Group Co. (TSE:FTG – Get Free Report) Director Amy Rice purchased 4,000 shares of Firan Technology Group stock in a transaction dated Monday, April 22nd. The shares were acquired at an average cost of C$3.62 per share, with a total value of C$14,480.00.

Firan Technology Group Stock Performance

Shares of TSE FTG traded down C$0.21 during midday trading on Monday, hitting C$4.94. 30,021 shares of the company’s stock traded hands, compared to its average volume of 23,504. Firan Technology Group Co. has a 1 year low of C$3.02 and a 1 year high of C$6.14. The stock has a market capitalization of C$117.92 million, a price-to-earnings ratio of 10.73 and a beta of 1.47. The company has a debt-to-equity ratio of 58.33, a quick ratio of 1.53 and a current ratio of 2.24. The firm has a fifty day moving average of C$5.51 and a 200 day moving average of C$4.54.

Firan Technology Group (TSE:FTG – Get Free Report) last announced its quarterly earnings data on Thursday, April 11th. The company reported C$0.04 earnings per share (EPS) for the quarter. The company had revenue of C$34.98 million during the quarter. Firan Technology Group had a return on equity of 21.58% and a net margin of 8.60%. On average, analysts forecast that Firan Technology Group Co. will post 0.34 earnings per share for the current year.

Analyst Ratings Changes

Separately, Acumen Capital upped their price target on shares of Firan Technology Group from C$6.00 to C$7.00 and gave the company a “buy” rating in a research report on Monday, April 15th.

View Our Latest Research Report on FTG

Firan Technology Group Company Profile

(Get Free Report)

Firan Technology Group Corporation manufactures and sells aerospace and defense electronic products and subsystems in Canada, the United States, Asia, Europe, and rest of Americas. The company operates in two segments, FTG Circuits and FTG Aerospace. It offers semi additive process technologies, high density interconnect products, high temperature rigid flex printed, RF boards, thermal management, and rigid flex and assembly products.