Berenberg Bank Upgrades BE Semiconductor Industries (OTCMKTS:BESIY) to Hold

Posted by Doug Wharley on Feb 26th, 2026

BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) was upgraded by stock analysts at Berenberg Bank to a “hold” rating in a note issued to investors on Monday,Zacks.com reports.

Several other brokerages also recently commented on BESIY. Needham & Company LLC raised BE Semiconductor Industries to a “buy” rating in a research report on Tuesday, January 6th. Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 13th. Kepler Capital Markets downgraded shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, January 9th. Sanford C. Bernstein reaffirmed an “outperform” rating on shares of BE Semiconductor Industries in a research report on Sunday, January 4th. Finally, Citigroup reissued a “neutral” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 20th. Five equities research analysts have rated the stock with a Buy rating and six have given a Hold rating to the company. Based on data from MarketBeat, BE Semiconductor Industries currently has a consensus rating of “Hold”.

Read Our Latest Analysis on BE Semiconductor Industries

BE Semiconductor Industries Trading Up 1.0%

Shares of BESIY opened at $234.99 on Monday. The company has a current ratio of 5.75, a quick ratio of 5.02 and a debt-to-equity ratio of 1.46. BE Semiconductor Industries has a one year low of $88.02 and a one year high of $235.17. The company’s fifty day moving average price is $190.83 and its 200 day moving average price is $165.26.

BE Semiconductor Industries Company Profile

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.