BE Semiconductor Industries (OTCMKTS:BESIY) Shares Gap Down – Here’s Why

Posted by Scott Moore on Mar 27th, 2026

BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) gapped down prior to trading on Friday . The stock had previously closed at $213.00, but opened at $203.00. BE Semiconductor Industries shares last traded at $200.52, with a volume of 1,632 shares changing hands.

Analyst Upgrades and Downgrades

BESIY has been the subject of a number of analyst reports. Sanford C. Bernstein reaffirmed an “outperform” rating on shares of BE Semiconductor Industries in a report on Sunday, January 4th. Citigroup restated a “neutral” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 20th. Needham & Company LLC upgraded BE Semiconductor Industries to a “buy” rating in a report on Tuesday, January 6th. Kepler Capital Markets lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, January 9th. Finally, Berenberg Bank upgraded BE Semiconductor Industries to a “hold” rating in a report on Monday, February 23rd. Five research analysts have rated the stock with a Buy rating and six have assigned a Hold rating to the stock. According to data from MarketBeat.com, the stock currently has a consensus rating of “Hold”.

Read Our Latest Analysis on BESIY

BE Semiconductor Industries Stock Performance

The stock’s 50-day moving average is $208.86 and its 200 day moving average is $176.11. The company has a debt-to-equity ratio of 1.22, a quick ratio of 4.88 and a current ratio of 5.55. The firm has a market cap of $14.43 billion, a P/E ratio of 106.42 and a beta of 1.81.

About BE Semiconductor Industries

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.