Disco (OTCMKTS:DSCSY) Sees Large Volume Increase – Here’s What Happened

Disco Corp (OTCMKTS:DSCSY) saw an uptick in trading volume on Monday . Approximately 381,633 shares changed hands during mid-day trading, an increase of 28% from the previous session’s volume of 297,277 shares.The stock last traded at $47.30 and had previously closed at $45.1250.

Wall Street Analysts Forecast Growth

Separately, Zacks Research lowered shares of Disco from a “strong-buy” rating to a “hold” rating in a research note on Tuesday, May 19th. One analyst has rated the stock with a Strong Buy rating and one has assigned a Hold rating to the stock. According to data from MarketBeat, the stock presently has a consensus rating of “Buy”.

Disco Stock Performance

The stock has a market capitalization of $51.42 billion, a P/E ratio of 57.80 and a beta of 1.50. The business has a 50-day moving average price of $46.33 and a 200 day moving average price of $43.05.

Disco (OTCMKTS:DSCSY) last announced its quarterly earnings data on Wednesday, April 22nd. The company reported $0.25 earnings per share (EPS) for the quarter. Disco had a return on equity of 25.27% and a net margin of 30.95%.The business had revenue of $848.13 million during the quarter, compared to analysts’ expectations of $771.53 million. As a group, research analysts forecast that Disco Corp will post 1.05 earnings per share for the current fiscal year.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.