Disco (OTCMKTS:DSCSY) Shares Gap Up – What’s Next?

Disco Corp (OTCMKTS:DSCSY) shares gapped up before the market opened on Monday . The stock had previously closed at $37.61, but opened at $39.47. Disco shares last traded at $39.53, with a volume of 38,666 shares.

Analysts Set New Price Targets

A number of equities research analysts have recently issued reports on DSCSY shares. Zacks Research lowered shares of Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. Jefferies Financial Group raised shares of Disco from a “hold” rating to a “buy” rating in a research note on Monday, July 27th. One investment analyst has rated the stock with a Buy rating and one has issued a Hold rating to the company’s stock. Based on data from MarketBeat.com, Disco has a consensus rating of “Moderate Buy”.

Disco Price Performance

The stock has a 50 day simple moving average of $44.14 and a two-hundred day simple moving average of $44.34. The company has a market cap of $42.24 billion, a price-to-earnings ratio of 44.76 and a beta of 1.55.

Disco (OTCMKTS:DSCSY) last issued its earnings results on Thursday, July 23rd. The company reported $0.20 earnings per share (EPS) for the quarter. Disco had a return on equity of 26.03% and a net margin of 31.65%.The business had revenue of $717.28 million during the quarter. As a group, research analysts forecast that Disco Corp will post 1.05 EPS for the current year.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.