Shares of BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) have been given a consensus rating of “Moderate Buy” by the nine analysts that are presently covering the stock, Marketbeat Ratings reports. One analyst has rated the stock with a sell rating, three have issued a hold rating, four have assigned a buy rating and one has given a strong buy rating to the company.
BESIY has been the topic of a number of research analyst reports. Berenberg Bank upgraded BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a research report on Tuesday, August 4th. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, September 8th. UBS Group lowered shares of BE Semiconductor Industries from a “buy” rating to a “sell” rating in a report on Wednesday, October 7th. Finally, Zacks Research lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, September 25th.
Read Our Latest Research Report on BE Semiconductor Industries
BE Semiconductor Industries Price Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last released its quarterly earnings data on Thursday, July 23rd. The technology company reported $1.29 earnings per share for the quarter, missing analysts’ consensus estimates of $1.30 by ($0.01). BE Semiconductor Industries had a return on equity of 46.44% and a net margin of 28.42%. The business had revenue of $290.52 million during the quarter, compared to the consensus estimate of $285.58 million. Research analysts expect that BE Semiconductor Industries will post 4.83 EPS for the current fiscal year.
About BE Semiconductor Industries
BE Semiconductor Industries N.V. (Besi) is a Netherlands-based manufacturer of semiconductor assembly equipment. The company develops and supplies systems used to assemble, package, and finish semiconductor devices after wafer fabrication.
Besi’s product portfolio includes die-attach equipment, packaging systems, molding and singulation equipment, plating systems, and related solutions for advanced semiconductor packaging. Its technologies support applications such as flip-chip, wafer-level packaging, thermo-compression bonding, and hybrid bonding, which are used in electronics, communications, automotive, computing, and other semiconductor markets.
Founded in 1995 and headquartered in Duiven, the Netherlands, Besi serves semiconductor manufacturers and assembly and test providers worldwide.
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