Short Interest in BE Semiconductor Industries NV (OTCMKTS:BESIY) Declines By 77.1%

BE Semiconductor Industries NV (OTCMKTS:BESIYGet Free Report) saw a large decline in short interest during the month of January. As of January 30th, there was short interest totaling 1,044 shares, a decline of 77.1% from the January 15th total of 4,556 shares. Based on an average trading volume of 6,665 shares, the short-interest ratio is presently 0.2 days. Based on an average trading volume of 6,665 shares, the short-interest ratio is presently 0.2 days.

BE Semiconductor Industries Trading Down 2.0%

BESIY stock opened at $201.40 on Friday. The company has a debt-to-equity ratio of 1.46, a current ratio of 5.75 and a quick ratio of 5.02. The stock’s fifty day simple moving average is $180.10 and its two-hundred day simple moving average is $159.88. BE Semiconductor Industries has a 1-year low of $88.02 and a 1-year high of $210.76.

Analyst Ratings Changes

A number of equities analysts recently weighed in on BESIY shares. Citigroup reaffirmed a “neutral” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 20th. Needham & Company LLC raised BE Semiconductor Industries to a “buy” rating in a report on Tuesday, January 6th. UBS Group restated a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, October 24th. Kepler Capital Markets downgraded BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, January 9th. Finally, Sanford C. Bernstein reissued an “outperform” rating on shares of BE Semiconductor Industries in a report on Sunday, January 4th. Five investment analysts have rated the stock with a Buy rating and five have assigned a Hold rating to the company. According to data from MarketBeat, BE Semiconductor Industries has a consensus rating of “Moderate Buy”.

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BE Semiconductor Industries Company Profile

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BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.

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