BE Semiconductor Industries (OTCMKTS:BESIY) Shares Gap Down – Here’s Why

Posted by Renee Jackson on Mar 20th, 2026

BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) gapped down prior to trading on Friday . The stock had previously closed at $220.00, but opened at $210.92. BE Semiconductor Industries shares last traded at $209.3950, with a volume of 1,427 shares trading hands.

Analyst Upgrades and Downgrades

BESIY has been the topic of a number of recent research reports. Citigroup reiterated a “neutral” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 20th. Kepler Capital Markets lowered shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research report on Friday, January 9th. Needham & Company LLC raised shares of BE Semiconductor Industries to a “buy” rating in a research note on Tuesday, January 6th. Berenberg Bank raised BE Semiconductor Industries to a “hold” rating in a report on Monday, February 23rd. Finally, Sanford C. Bernstein reissued an “outperform” rating on shares of BE Semiconductor Industries in a report on Sunday, January 4th. Five research analysts have rated the stock with a Buy rating and six have issued a Hold rating to the company’s stock. According to MarketBeat, the company presently has an average rating of “Hold”.

Read Our Latest Analysis on BE Semiconductor Industries

BE Semiconductor Industries Price Performance

The stock has a market capitalization of $15.15 billion, a P/E ratio of 111.71 and a beta of 1.81. The company’s 50 day simple moving average is $206.45 and its two-hundred day simple moving average is $173.09. The company has a debt-to-equity ratio of 1.22, a current ratio of 5.55 and a quick ratio of 5.02.

About BE Semiconductor Industries

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.