BE Semiconductor Industries (OTCMKTS:BESIY) Reaches New 52-Week High – Here’s Why

BE Semiconductor Industries NV (OTCMKTS:BESIYGet Free Report)’s share price hit a new 52-week high during trading on Wednesday . The stock traded as high as $239.37 and last traded at $238.00, with a volume of 1760 shares changing hands. The stock had previously closed at $224.50.

Analysts Set New Price Targets

Several brokerages have recently weighed in on BESIY. Kepler Capital Markets downgraded BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, January 9th. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, January 13th. Sanford C. Bernstein restated an “outperform” rating on shares of BE Semiconductor Industries in a report on Sunday, January 4th. Berenberg Bank upgraded BE Semiconductor Industries to a “hold” rating in a report on Monday, February 23rd. Finally, Citigroup restated a “neutral” rating on shares of BE Semiconductor Industries in a report on Tuesday, January 20th. Five investment analysts have rated the stock with a Buy rating and six have issued a Hold rating to the company’s stock. According to data from MarketBeat, the stock currently has a consensus rating of “Hold”.

Check Out Our Latest Report on BESIY

BE Semiconductor Industries Price Performance

The company has a quick ratio of 4.88, a current ratio of 5.55 and a debt-to-equity ratio of 1.22. The firm has a fifty day moving average price of $210.56 and a two-hundred day moving average price of $181.20. The stock has a market capitalization of $17.40 billion, a P/E ratio of 128.31 and a beta of 1.78.

BE Semiconductor Industries Company Profile

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.

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