Disco Corp (OTCMKTS:DSCSY) Short Interest Up 747.0% in May

Disco Corp (OTCMKTS:DSCSY) saw a large growth in short interest in May. As of May 15th, there was short interest totaling 168,911 shares, a growth of 747.0% from the April 30th total of 19,942 shares. Currently, 0.0% of the shares of the company are short sold. Based on an average trading volume of 220,200 shares, the days-to-cover ratio is presently 0.8 days.

Analysts Set New Price Targets

Separately, Zacks Research lowered shares of Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. One analyst has rated the stock with a Strong Buy rating and one has issued a Hold rating to the company. Based on data from MarketBeat.com, the stock currently has a consensus rating of “Buy”.

Disco Trading Down 1.1%

Disco stock opened at $42.35 on Thursday. The firm has a 50 day moving average of $43.69 and a 200 day moving average of $39.64. The firm has a market capitalization of $45.94 billion, a price-to-earnings ratio of 51.65 and a beta of 1.63. Disco has a 12-month low of $22.08 and a 12-month high of $52.99.

Disco (OTCMKTS:DSCSY) last released its earnings results on Wednesday, April 22nd. The company reported $0.25 earnings per share (EPS) for the quarter. The company had revenue of $848.13 million during the quarter, compared to analyst estimates of $771.53 million. Disco had a net margin of 30.95% and a return on equity of 25.27%. On average, analysts predict that Disco will post 1.07 EPS for the current year.

About Disco

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.