Taiwan Semiconductor Manufacturing Company Ltd. (NYSE:TSM – Get Free Report) declared a quarterly dividend on Tuesday, August 11th. Investors of record on Thursday, December 10th will be given a dividend of 1.0854 per share by the semiconductor company on Thursday, January 7th. This represents a c) annualized dividend and a yield of 1.0%. The ex-dividend date of this dividend is Thursday, December 10th.
Taiwan Semiconductor Manufacturing has increased its dividend payment by an average of 0.1%annually over the last three years. Taiwan Semiconductor Manufacturing has a dividend payout ratio of 32.5% meaning its dividend is sufficiently covered by earnings. Equities research analysts expect Taiwan Semiconductor Manufacturing to earn $20.87 per share next year, which means the company should continue to be able to cover its $3.51 annual dividend with an expected future payout ratio of 16.8%.
Taiwan Semiconductor Manufacturing Price Performance
TSM stock traded up $7.63 during midday trading on Wednesday, hitting $429.69. 3,936,014 shares of the stock were exchanged, compared to its average volume of 13,954,669. The stock’s 50-day moving average price is $426.20 and its 200-day moving average price is $388.73. The company has a debt-to-equity ratio of 0.13, a quick ratio of 2.25 and a current ratio of 2.46. The stock has a market cap of $2.23 trillion, a price-to-earnings ratio of 31.00, a PEG ratio of 0.96 and a beta of 1.38. Taiwan Semiconductor Manufacturing has a fifty-two week low of $223.70 and a fifty-two week high of $479.00.
Taiwan Semiconductor Manufacturing Company Profile
Taiwan Semiconductor Manufacturing Company (TSMC) is a leading pure-play semiconductor foundry that provides wafer fabrication and related services to the global semiconductor industry. Founded in 1987 by Morris Chang and headquartered in Hsinchu, Taiwan, TSMC manufactures integrated circuits on behalf of fabless and integrated device manufacturers, offering contract chip production across a broad set of technologies and products.
TSMC’s service offering covers logic and mixed-signal process technologies, specialty processes for radio-frequency, power management and embedded memory, and advanced nodes used in mobile, high-performance computing and AI applications.
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