BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) saw an uptick in trading volume on Wednesday . 26,691 shares traded hands during trading, an increase of 228% from the previous session’s volume of 8,144 shares.The stock last traded at $267.8610 and had previously closed at $261.11.
Analysts Set New Price Targets
A number of research firms have weighed in on BESIY. Deutsche Bank Aktiengesellschaft reissued a “buy” rating on shares of BE Semiconductor Industries in a research note on Friday, May 15th. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, May 19th. Berenberg Bank raised BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a report on Tuesday, August 4th. Finally, Zacks Research upgraded BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a research report on Wednesday, July 29th. Two analysts have rated the stock with a Strong Buy rating, five have issued a Buy rating and two have assigned a Hold rating to the company’s stock. Based on data from MarketBeat.com, the stock presently has an average rating of “Buy”.
Get Our Latest Report on BESIY
BE Semiconductor Industries Stock Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last released its quarterly earnings data on Thursday, July 23rd. The technology company reported $1.29 earnings per share (EPS) for the quarter, missing the consensus estimate of $1.30 by ($0.01). BE Semiconductor Industries had a return on equity of 46.44% and a net margin of 28.42%.The firm had revenue of $290.52 million for the quarter, compared to analyst estimates of $285.58 million. On average, analysts expect that BE Semiconductor Industries NV will post 4.83 EPS for the current fiscal year.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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