Disco (OTCMKTS:DSCSY) Shares Gap Up – Still a Buy?

Disco Corp (OTCMKTS:DSCSY)’s share price gapped up before the market opened on Monday . The stock had previously closed at $36.98, but opened at $38.47. Disco shares last traded at $37.8450, with a volume of 23,055 shares changing hands.

Wall Street Analysts Forecast Growth

A number of research analysts have recently commented on DSCSY shares. Zacks Research lowered Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. Jefferies Financial Group raised shares of Disco from a “hold” rating to a “buy” rating in a report on Monday, July 27th. One investment analyst has rated the stock with a Buy rating and one has assigned a Hold rating to the stock. According to data from MarketBeat.com, the stock presently has an average rating of “Moderate Buy”.

Disco Stock Down 0.4%

The firm’s 50-day simple moving average is $42.64 and its 200 day simple moving average is $44.05. The stock has a market capitalization of $41.31 billion, a P/E ratio of 43.77 and a beta of 1.55.

Disco (OTCMKTS:DSCSY) last posted its quarterly earnings data on Thursday, July 23rd. The company reported $0.20 earnings per share for the quarter. Disco had a net margin of 31.65% and a return on equity of 26.03%. The company had revenue of $717.28 million during the quarter. As a group, equities analysts anticipate that Disco Corp will post 1.05 EPS for the current fiscal year.

Institutional Trading of Disco

A hedge fund recently bought a new position in Disco stock. Azimuth Capital Investment Management LLC purchased a new position in Disco Corp (OTCMKTS:DSCSY) during the 2nd quarter, according to the company in its most recent 13F filing with the Securities & Exchange Commission. The fund purchased 237,250 shares of the company’s stock, valued at approximately $11,862,000. 0.03% of the stock is owned by institutional investors and hedge funds.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.