BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report)’s share price gapped up before the market opened on Tuesday. The stock had previously closed at $163.30, but opened at $178.87. BE Semiconductor Industries shares last traded at $179.33, with a volume of 1,535 shares trading hands.
Analyst Ratings Changes
A number of brokerages have recently commented on BESIY. Zacks Research lowered shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, September 25th. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, September 8th. UBS Group downgraded shares of BE Semiconductor Industries from a “buy” rating to a “sell” rating in a report on Wednesday, October 7th. Finally, Berenberg Bank upgraded shares of BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a research report on Tuesday, August 4th. One analyst has rated the stock with a Strong Buy rating, four have given a Buy rating, three have assigned a Hold rating and one has issued a Sell rating to the company. According to MarketBeat, BE Semiconductor Industries has an average rating of “Moderate Buy”.
Check Out Our Latest Stock Report on BESIY
BE Semiconductor Industries Price Performance
The company has a debt-to-equity ratio of 0.60, a quick ratio of 3.73 and a current ratio of 4.28. The stock has a market capitalization of $13.07 billion, a P/E ratio of 59.08 and a beta of 1.99. The firm has a 50-day moving average price of $212.95 and a 200 day moving average price of $246.25.
About BE Semiconductor Industries
BE Semiconductor Industries N.V. (BESI) is a Netherlands-based manufacturer of semiconductor assembly equipment. The company develops and supplies systems used to package semiconductor devices after wafer fabrication, helping customers assemble, connect, protect and test chips for use in electronic products.
BESI’s product portfolio includes die-attach equipment, packaging systems, molding equipment and singulation systems. Its technologies support applications such as advanced semiconductor packaging, flip-chip assembly, thermo-compression bonding and hybrid bonding, which are used in products requiring higher performance, smaller dimensions and improved power efficiency.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI serves semiconductor manufacturers and assembly and test providers worldwide.
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