BE Semiconductor Industries NV (OTCMKTS:BESIY) Stock Now Rated “Moderate Buy” by Sell-Side Analysts

BE Semiconductor Industries NV (OTCMKTS:BESIY) has been assigned an average rating of “Moderate Buy” from the nine ratings firms that are covering the company, Marketbeat.com reports. One investment analyst has rated the stock with a sell recommendation, three have issued a hold recommendation, four have issued a buy recommendation and one has issued a strong buy recommendation on the company.

A number of analysts recently issued reports on BESIY shares. UBS Group lowered BE Semiconductor Industries from a “buy” rating to a “sell” rating in a research note on Wednesday, October 7th. Zacks Research downgraded BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, September 25th. Berenberg Bank raised BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a report on Tuesday, August 4th. Finally, Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, September 8th.

BE Semiconductor Industries Price Performance

Shares of OTCMKTS:BESIY opened at $171.49 on Friday. The company has a quick ratio of 3.73, a current ratio of 4.28 and a debt-to-equity ratio of 0.60. The firm has a market capitalization of $12.43 billion, a PE ratio of 40.83 and a beta of 1.99. BE Semiconductor Industries has a twelve month low of $140.07 and a twelve month high of $374.33. The company has a 50-day moving average price of $206.82 and a two-hundred day moving average price of $246.22.

BE Semiconductor Industries Company Profile

BE Semiconductor Industries N.V. (BESI) is a Netherlands-based manufacturer of semiconductor assembly equipment. The company develops and supplies systems used to package semiconductor devices after wafer fabrication, helping customers assemble, connect, protect and test chips for use in electronic products.

BESI’s product portfolio includes die-attach equipment, packaging systems, molding equipment and singulation systems. Its technologies support applications such as advanced semiconductor packaging, flip-chip assembly, thermo-compression bonding and hybrid bonding, which are used in products requiring higher performance, smaller dimensions and improved power efficiency.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI serves semiconductor manufacturers and assembly and test providers worldwide.