BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report)’s stock price dropped 10.2% during mid-day trading on Monday . The company traded as low as $285.79 and last traded at $285.79. 1,061 shares traded hands during mid-day trading, a decline of 85% from the average session volume of 7,277 shares. The stock had previously closed at $318.26.
Analysts Set New Price Targets
A number of equities research analysts recently commented on BESIY shares. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, May 19th. Deutsche Bank Aktiengesellschaft reissued a “buy” rating on shares of BE Semiconductor Industries in a research note on Friday, May 15th. Finally, Zacks Research cut BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, June 26th. Five investment analysts have rated the stock with a Buy rating and four have issued a Hold rating to the company’s stock. According to data from MarketBeat, BE Semiconductor Industries currently has a consensus rating of “Moderate Buy”.
View Our Latest Research Report on BESIY
BE Semiconductor Industries Price Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last issued its quarterly earnings results on Thursday, April 23rd. The technology company reported $0.76 earnings per share (EPS) for the quarter, meeting the consensus estimate of $0.76. The business had revenue of $216.51 million for the quarter, compared to analyst estimates of $220.77 million. BE Semiconductor Industries had a return on equity of 38.42% and a net margin of 24.02%. As a group, equities research analysts forecast that BE Semiconductor Industries NV will post 4.45 earnings per share for the current year.
About BE Semiconductor Industries
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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